Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperSilylation of resist materials using di- and polyfunctional organosilicon compoundsE. Babich, J. Paraszczak, et al.Microelectronic Engineering
Conference paperInvestigation of the numerical accuracy of transmission line-based transient analysis of high-speed interconnects and cablesAndreas C. Cangellaris, Karen M. Coperich, et al.EMC 2001
