Theory for electromigration failure in Cu conductors
J.R. Lloyd, C.E. Murray, et al.
International Workshop on Stress-Induced Phenomena in Metallization 2005
The (buried) interface between a polycrystalline Al thin-film feature and its substrate (single crystal Si) was characterized with x-ray microdiffraction. Using a focused x-ray beam (effective spot size on the specimen ∼2×12 μm) with the Si 004 reflection, topographic images of the Si around and under the metallization feature were constructed. Comparison with shear-lag model calculations indicate that the interface is not fully coupled despite the absence of surface cracks. © 1998 American Institute of Physics.
J.R. Lloyd, C.E. Murray, et al.
International Workshop on Stress-Induced Phenomena in Metallization 2005
C.-K. Hu, L. Gignac, et al.
ECS Meeting 2006
Mikhail Treger, Christian Witt, et al.
Journal of Applied Physics
C.R. Harkless, M.A. Singh, et al.
Physical Review Letters