Characterization of flip chip microjoins up to 40 GHz using silicon carrier

Electrical characterization results of fine pitch flip chip interconnections, called microjoins, using a silicon carrier are reported. Microjoins with 50 μm diameter, 100 μm pitch are assembled onto silicon carrier and characterized up to 40 GHz using transmission line test macros. Time and frequency domain measurements of a single 50 μm diameter microjoin give 6 ps delay and less than -0.5 dB transmission losses up to 40 GHz. © 2005 IEEE.