PaperDirected assembly of lamellae-forming block copolymers by using chemically and topographically patterned substratesSang-Min Park, Mark P. Stoykovich, et al.Advanced Materials
Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
Conference paperFormation mechanism and suppression methods of copper dendrites in BEOL integrationShaoning Yao, Wei-Tsu Tseng, et al.ADMETA 2011
