Buried oxide channel field effect transistor

Abstract

A room temperature oxide channel field effect transistor with the channel on the surface was recently demonstrated at IBM which showed switching characteristics similar to conventional silicon FETs. In this paper we introduce a new architecture for the oxide channel transistor where the oxide channel material is buried below the gate oxide layer. This buried channel architecture has several significant advantages over the surface channel design in coupling capacitance, channel mobility, and channel stability. We will discuss the design and fabrication of the buried channel oxide FET and we will present results from these devices which demonstrate a higher transconductance.