Conference paper
High-throughput photonic packaging
Tymon Barwicz, Ted W. Lichoulas, et al.
OFC 2017
We demonstrate self-aligned assembly of LC-terminated fibers to chips in a manner compatible with standard microelectronics assembly lines. We show -1.5dB peak transmission to chip with 0.9dB penalty over a 100nm bandwidth and all polarization.
Tymon Barwicz, Ted W. Lichoulas, et al.
OFC 2017
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GFP 2015
Chu C. Teng, Eric J. Zhang, et al.
CLEO 2018
Alexander Janta-Polczynski, Tymon Barwicz, et al.
ECOC 2020