William P. King, Thomas W. Kenny, et al.
JMEMS
Heat conduction governs the ultimate writing and reading capabilities of a thermomechanical data storage device. This work investigates transient heat conduction in a resistively heated atomic force microscope cantilever through measurement and simulation of cantilever thermal and electrical behavior. The time required to heat a single cantilever to bit-writing temperature is near 1 μs and the thermal data reading sensitivity ΔR/R is near 1 × 10-4 per vertical nm. Finite-difference thermal and electrical simulation results compare well with electrical measurements during writing and reading, indicating design tradeoffs in power requirements, data writing speed, and data reading sensitivity. We present a design for a proposed cantilever that is predicted to be faster and more sensitive than the present cantilever. © 2001 American Institute of Physics.
William P. King, Thomas W. Kenny, et al.
JMEMS
Benjamin W. Chui, Thomas W. Kenny, et al.
IMECE 1997
Benjamin W. Chui, Thomas W. Kenny, et al.
IMECE 1997
Jaeho Lee, Sangbum Kim, et al.
IEEE Electron Device Letters