Application of scatterometry to BEOL measurements: Post Cu CMP measurements

Abstract

With shrinking interconnect dimensions, as a result of scaling, resistance variations in percentage terms are increasing. Quick and reliable measurements on the interconnect structures are the first step to the detection and implementation of a process-control strategy in order to reduce process related variations. This paper discusses the application of Optical Digital Profilometry (ODP) to the measurement of back end of line (BEOL) parameters, specifically the measurement of post copper-chemical mechanical planarization (CMP) metal dimensions with the intention of understanding CMP related contribution to resistance variations. Traditionally a combination of electrical test, optical metrology and profilometry is needed to understand the contribution of CMP to the interconnect and inter-layer-dielectric (ILD) dimensions. This paper discusses the successful use of ODP to model and measure the dimensions of both the metal and the dielectric in nested patterned structures with different pattern densities for a single level patterned build. Hence this technique could potentially simplify and replace multiple measurement techniques and help in quickly providing relevant information for process monitoring and control. © 2007 Materials Research Society.