Devin Underwood, Joseph Glick, et al.
APS March Meeting 2024
Phased-array modules at frequencies >20 GHz are expected to play an important role for 5G applications. Antenna-in-package (AiP) is a reliable and cost-effective method to realize these phased arrays. This paper introduces a practical Ka-band AiP structure and discusses the antenna element design and implementation tradeoffs. The AiP design is based on multilayer organic buildup substrates that are suitable for phased-array module integration needs and supports both horizontal and vertical polarizations. Measurement results from the fabricated antenna prototypes show 0.8 GHz return loss bandwidth and 3.8-dBi peak gain at 30.5 GHz. Simulation results agree with the measured ones.
Devin Underwood, Joseph Glick, et al.
APS March Meeting 2024
Dong G. Kam, Mark B. Ritter, et al.
IEEE Transactions on Advanced Packaging
Duixian Liu, Christian Baks, et al.
APSURSI 2016
Duixian Liu, Christian Baks, et al.
APSURSI 2016