Conference paper
HIGH RESOLUTION THERMAL MICROSCOPY.
C.C. Williams, H.K. Wickramasinghe
IUS 1985
We describe a new type of jet plating that uses a focused high-frequency sound field directed through the center of the jet. The acoustic jet results in an improved morphology for gold and copper depositions although plating rates are not enhanced. Four-point probe measurements of acoustic-jet plated copper lines show up to a 50% decrease in electrical resistivity compared to jet plated deposits.
C.C. Williams, H.K. Wickramasinghe
IUS 1985
R.J. Von Gutfeld, D.R. Vigliotti, et al.
Applied Physics Letters
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Applied Physics Letters
Y. Martin, C.C. Williams, et al.
Journal of Applied Physics