Tejas Jhaveri, Vyacheslav Rovner, et al.
IEEE TCADIS
The major challenges of subresolution lithography, and modern double-patterning (DP) lithography solutions are reviewed. Hiding the complexity of DP from the designers leads to suboptimal design efficiency and overly constrains design options. Decomposition transparency through split-level design rules enables maximum design differentiation and allows designs to tailor DP-enhanced design methodologies to their specific needs. The review emphasizes that well-integrated DP-enhanced EDA solutions, such as DP-enhanced DRC, placement, routing, and extraction, preserve design efficiency. The IBM JDA design-technology cooptimization (DTCO) process provides a forum to identify high-leverage process challenges, such as same color metal spacing at the contacted poly pitch, that help reduce design impact of DP with well controlled process risk.
Tejas Jhaveri, Vyacheslav Rovner, et al.
IEEE TCADIS
Mark Lavin, Lars Liebmann
ICCAD 2002
Lars Liebmann, Jennifer Lund, et al.
Proceedings - Design Automation Conference
Lars Liebmann, Greg Northrop, et al.
SPIE Advanced Microelectronic Manufacturing 2003