A chip-scale packaging technology for 60-GHz wireless chipsets

Abstract

In this paper, we present a cost-effective chip-scale packaging solution for a 60-GHz industrial-scientific-medical band receiver (Rx) and transmitter (Tx) chipset capable of gigabit-per-second wireless communications. Envisioned applications of the packaged chipset include 1-3-Gb/s directional links using amplitude shift-keying or phase shift-keying modulation and 500-Mb/s-1-Gb/s omni-directional links using orthogonal frequency-division multiplexing modulation. This paper demonstrates the first fully package-integrated 60-GHz chipset including receive and transmit antennas in a cost-effective plastic package. A direct-chip-attach (DCA) and surface mountable land-grid-array (LGA) package technology is presented. The size of the DCA package is 7 × 11 mm 2 and the LGA package size is 6 × 13 mm 2. Optionally, the Tx and Rx chip can be packaged together with Tx and Rx antennas in a combined 13 × 13 mm 2 LGA transceiver package. © 2006 IEEE.