J.M.E. Harper, L. Clevenger, et al.
MRS Fall Meeting 1993
25-nm-wide lines and spaces have been fabricated in 22.5-nm-thick films of PdAu (40: 60) using electron-beam exposure and polymethylmethacrylate (PMMA) resist. A high-resolution scanning transmission electron microscopy (STEM) was used to expose the resist and the samples were mounted on 60-nm-thick Si 3N4 membrane substrates. Previously, the smallest metal structures formed with a resist process were 60 nm wide with spaces between the lines several times larger than the lines. The results presented here show that 25-nm lines can be fabricated with a center to center spacing of 50 nm.
J.M.E. Harper, L. Clevenger, et al.
MRS Fall Meeting 1993
A. Gungor, K. Barmak, et al.
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
J.M.E. Harper
Emergent Process Methods for High-Technology Ceramics 1983
C. Cabral Jr., C. Lavoie, et al.
Thin Solid Films